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Showing posts with the label AI chip supply chain

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Market Daily Report: Bursa Malaysia Ends Nearly Flat As Construction Stocks Attract Buying

 KUALA LUMPUR, Sept 8 (Bernama) -- Bursa Malaysia closed almost flat on Tuesday as buying interest rotated away from index heavyweights towards smaller-cap construction stocks, with sentiment affected by geopolitical uncertainty, said an analyst. At 5 pm, the FTSE Bursa Malaysia KLCI (FBM KLCI) eased 0.39 of a point to 1,714.40 from Monday’s close of 1,714.79. The benchmark index opened 1.65 points lower at 1,713.14 and moved between 1,710.44 and 1,714.50 throughout the trading session. The broader market was almost evenly balanced, with decliners leading gainers 548 to 546, while 598 counters were unchanged, 1,107 were untraded and 25 were suspended. Turnover expanded to 4.13 billion units valued at RM3.14 billion from 3.60 billion units valued at RM2.45 billion on Monday.

Samsung Follows Micron with Memory Price Hikes as AI Demand Tightens Supply

Memory chipmakers are moving in sync on price increases as AI demand stretches supply across both training and inference workloads. Market Snapshot Samsung  to raise LPDDR4X/LPDDR5/5X prices by  15%–30%  in 4Q; eMMC/UFS up  5%–10% . Micron (MU)  reportedly planning  20%–30% hikes  on DDR4/DDR5. Capacity shift : DDR4 supply could drop to  20% of current levels by 2026 . AI pull-through : Tightness expected in both DRAM and NAND, with the up-cycle possibly lasting into 1H26. HDD strain  pushing faster SSD adoption; QLC SSD shipments could surge in 2026. What’s Driving the Price Hikes Capacity pivots : Samsung, SK hynix, and Micron are reallocating production toward DDR5 and high-bandwidth memory (HBM), accelerating DDR4 phase-out. AI demand : As workloads shift from training to inference and the edge, demand for both high-capacity DRAM and NAND is tightening. Industry Outlook Local reports suggest the  pricing up-cycle may extend through y...

LG Electronics Surges on AI Chip Equipment Ambition

Shares of  LG Electronics Inc  jumped in Seoul after reports surfaced that the company is diving into the  AI chip supply chain  — specifically in the development of  hybrid bonders  for  high-bandwidth memory (HBM)  chips. What’s the Buzz? Local media reports  LG is working on  tools essential to stack memory chips  used alongside AI processors like those from Nvidia. Targeted  mass production  of hybrid bonders is  set for 2028 , though LG has yet to confirm the timeline. Hybrid bonders are  vital for HBM manufacturing , enabling thinner, faster memory stacks for AI workloads. Market Ripple Effect LG Electronics stock  rose on the news. Meanwhile,  existing players  in the bonder space —  Hanmi Semiconductor (-6.5%) ,  Hanwha Vision (-4.7%) , and  Samsung Electronics (-1.3%)  — saw declines as investors reacted to potential new competition. Analyst Take “Entry barrier is high,...

US Set to Tighten AI Chip Exports to Malaysia and Thailand: Rising Geopolitical Tensions Pose Investment Risks and Realignment Opportunities

In a significant move aimed at curbing technology leakage to China, the US is preparing to  restrict shipments of advanced AI chips  to Malaysia and Thailand, escalating trade and security scrutiny in Southeast Asia. The planned measure, spearheaded by the  Commerce Department , is part of a broader strategy by the Trump administration to tighten controls over semiconductor flows amid suspicions of  smuggling and indirect transfers to China . Key Points: The draft rule would  limit the export of Nvidia’s AI chips  and similar products to Malaysia and Thailand. These two countries have become  key hubs for global semiconductor assembly and data infrastructure , especially with the rise of AI cloud computing. The regulation will  rescind certain global curbs from the previous AI diffusion rule , but will  retain China-focused chip restrictions  alongside measures for 40+ other countries deemed high-risk. Companies from the US and allied co...